The key driving factors behind the increasing demand for low power semiconductor components in the IoT market is the need for energy-efficient devices.
Global Data Insights Consultancy announces the release of the report "Global Low Power Semiconductor Components for IoT Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2034”. This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share. The report provides an in-depth analysis of the competitive landscape, manufacturer's profiles, regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global Low Power Semiconductor Components for IoT Market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.
The report presents authenticated data derived from extensive primary and secondary research. By analysing historical growth trends and the current market landscape, it aims to provide actionable insights and forecasts for global and regional market growth. It takes into account revenue generated from report sales and related technologies across various application segments while exploring market data tables. Key market factors, including macroeconomic conditions, the overall market environment, government policies, and the competitive landscape, are carefully examined to ensure a comprehensive analysis.
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Competitive Landscape: Low Power Semiconductor Components for IoT Market
Some of the major players in the Low Power Semiconductor Components for IoT Market are:
1. Intel Corporation
2. Qualcomm Technologies, Inc.
3. Texas Instruments Incorporated
4. STMicroelectronics N.V.
5. NXP Semiconductors N.V.
6. MediaTek Inc.
7. Broadcom Inc.
8. Microchip Technology Inc.
9. Analog Devices, Inc.
10. Infineon Technologies AG
11. Renesas Electronics Corporation
12. ON Semiconductor Corporation (onsemi)
13. Dialog Semiconductor (acquired by Renesas)
14. Silicon Labs
15. Nordic Semiconductor ASA
16. Maxim Integrated (now part of Analog Devices)
17. Semtech Corporation
18. Marvell Technology, Inc.
19. Realtek Semiconductor Corp.
20. Ambiq Micro, Inc.
Recent Development:
September 11, 2024: Infineon Technologies announced a significant breakthrough in gallium nitride (GaN) chip production by successfully manufacturing GaN chips on 300mm wafers—a world first. This advancement allows for 2.3 times more chips per wafer compared to the standard 200mm wafers, significantly reducing production costs. GaN chips are favored for their efficiency and are poised to become more cost-competitive with silicon chips, making them suitable for high-performance, low-power IoT applications.
September 2024: ON Semiconductor (Onsemi) is investing $2 billion in a new plant in the Czech Republic and expanding manufacturing capacity in South Korea. This strategic move aims to diversify its supply chain and mitigate risks associated with geopolitical tensions and reliance on Chinese suppliers. The expansion focuses on producing silicon-carbide chips, which are essential for energy-efficient applications in electric vehicles and data centers, aligning with the growing demand for low-power semiconductor components in IoT devices.
October 13, 2024: T-Mobile and AT&T are preparing to launch devices utilizing RedCap (Reduced Capability), a 5G specification designed for IoT devices such as wearables and sensors. RedCap offers a low-bandwidth, power-efficient version of 5G, providing simpler connectivity for devices that require less data throughput. This development is expected to enhance the performance and battery life of IoT devices, facilitating broader adoption in various sectors.
Low Power Semiconductor Components for IoT Market Segmentation
By Component Type
Microcontrollers (MCUs)
Sensors
Transceivers
Power Management Integrated Circuits (PMICs)
Memory (Low-power SRAM, Flash, etc.)
Application-Specific Integrated Circuits (ASICs)
Field-Programmable Gate Arrays (FPGAs)
By Technology
CMOS (Complementary Metal-Oxide-Semiconductor)
MEMS (Micro-Electro-Mechanical Systems)
SoC (System-on-Chip)
RF and Analog/Mixed-Signal
By Power Range
Ultra-Low Power (<1 mW)
Low Power (1 mW – 100 mW)
Moderate Power (100 mW – 500 mW)
By Application
Smart Home Devices
Wearables & Consumer Electronics
Industrial IoT (IIoT)
Healthcare Devices
Smart Agriculture
Connected Vehicles
Retail & Logistics (RFID, Trackers)
By End-Use Industry
Consumer Electronics
Automotive
Healthcare
Industrial Automation
Energy & Utilities
Transportation & Logistics
Low Power Semiconductor Components for IoT Market Regional Analysis
North America (USA and Canada)
Europe (UK, Germany, France and rest of Europe)
Asia-Pacific (China, Japan, India, and Rest of Asia Pacific)
Latin America (Brazil, Mexico, and Rest of Latin America)
Middle East and Africa (GCC and Rest of the Middle East and Africa)
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Important Features of the reports:
- Detailed analysis of the Low Power Semiconductor Components for IoT Market
- Fluctuating market dynamics of the industry
- Detailed Low Power Semiconductor Components for IoT Market segmentation
- Historical, current and projected market size in terms of volume and value
- Recent industry trends and developments
- Competitive landscape of the Low Power Semiconductor Components for IoT Market
- Strategies of key players and product offerings
- Potential and niche segments/regions exhibiting promising growth
- A neutral perspective towards Low Power Semiconductor Components for IoT Market performance.
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