The High-Density Interconnect (HDI) PCBs for Semiconductor Market Size will be valued at USD 13.9 billion by 2034, and it accounted for USD 9.1 billion in 2024, and grow at a CAGR of 4.50% over the forecast period 2025-2034.
Global Data Insights Consultancy announces the release of the report "Global High-Density Interconnect (HDI) PCBs for Semiconductor Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2034”. This report provides a detailed overview of the market scenario, including a thorough analysis of the market size, sales quantity, average price, revenue, gross margin and market share. The report provides an in-depth analysis of the competitive landscape, manufacturer's profiles, regional and national market dynamics, and the opportunities and challenge that the market may be exposed to in the near future. Global High-Density Interconnect (HDI) PCBs for Semiconductor Market research report is a comprehensive analysis of the current market trends, future prospects, and other pivotal factors that drive the market.
The report presents authenticated data derived from extensive primary and secondary research. By analysing historical growth trends and the current market landscape, it aims to provide actionable insights and forecasts for global and regional market growth. It takes into account revenue generated from report sales and related technologies across various application segments while exploring market data tables. Key market factors, including macroeconomic conditions, the overall market environment, government policies, and the competitive landscape, are carefully examined to ensure a comprehensive analysis.
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Competitive Landscape:
Some of the major players in the High-Density Interconnect (HDI) PCBs for Semiconductor Market are:
1. AT&S (Austria Technologie & Systemtechnik AG)
2. Compeq Manufacturing Co., Ltd.
3. Daeduck Electronics Co., Ltd.
4. DSBJ (Dongshan Precision Manufacturing Co., Ltd.)
5. Dynamic Electronics Co., Ltd.
6. Ibiden Co., Ltd.
7. ISU Petasys Co., Ltd.
8. Kinsus Interconnect Technology Corp.
9. Meiko Electronics Co., Ltd.
10. Multek (A Flex Company)
11. NCAB Group
12. Nippon Mektron, Ltd.
13. Panasonic Industry Co., Ltd.
14. Simmtech Co., Ltd.
15. Shenzhen Kinwong Electronic Co., Ltd.
16. Shennan Circuits Co., Ltd.
17. TTM Technologies, Inc.
18. Unimicron Technology Corporation
19. Tripod Technology Corporation
20. Zhen Ding Technology Holding Limited
Recent Development:
In November 2023, Kaynes Technology introduced High-Density Interconnect (HDI) board manufacturing, aiming to enrich the Electronic Manufacturing Services (EMS) ecosystem.
In 2023, NCAB Group committed to IPC’s work developing standards for ultra-dense Ultra HDI PCBs and is positioned to deliver these to customers.
In June 2023, Apple announced plans to introduce resin-coated copper (RCC) materials in its iPhone models in 2024, replacing some copper-clad laminates to reduce mainboard thickness and enhance signal efficiency.
In May 2022, Summit Interconnect Inc. acquired Royal Circuit Solutions, enhancing its engineering and service resources for complex HDI PCB manufacturing.
High-Density Interconnect (HDI) PCBs for Semiconductor Market – Segmentation
By Product Type Outlook (Revenue, USD Billion, 2020 – 2034)
1+N+1 HDI PCBs
2+N+2 HDI PCBs
3+N+3 and above HDI PCBs
Any-Layer HDI PCBs
Via-in-Pad HDI PCBs
Others (e.g., hybrid types)
By Material Type Outlook (Revenue, USD Billion, 2020 – 2034)
FR-4 (Flame Retardant 4)
Polyimide
Rogers Material
Others (e.g., Teflon, CEM)
By Application Outlook (Revenue, USD Billion, 2020 – 2034)
Consumer Electronics
Smartphones
Tablets
Wearables
Automotive Electronics
ADAS (Advanced Driver-Assistance Systems)
Infotainment Systems
EV Powertrains
Telecommunication Equipment
5G Infrastructure
Network Routers and Switches
Medical Devices
Diagnostic Equipment
Portable Devices
Industrial Electronics
Automation Systems
IoT Devices
Aerospace and Defense
Avionics
Radar Systems
By End User / Industry Vertical Outlook (Revenue, USD Billion, 2020 – 2034)
Semiconductor Manufacturers
OEMs (Original Equipment Manufacturers)
ODM/EMS Providers
Defense and Aerospace Contractors
Automotive OEMs
By Laminate Build-Up Technology Outlook (Revenue, USD Billion, 2020 – 2034)
Sequential Lamination
Laser Drilled Microvia
Stacked/Skip Via
Copper Filled Via
High-Density Interconnect (HDI) PCBs for Semiconductor Market Regional Analysis
North America (USA and Canada)
Europe (UK, Germany, France and rest of Europe)
Asia-Pacific (China, Japan, India, and Rest of Asia Pacific)
Latin America (Brazil, Mexico, and Rest of Latin America)
Middle East and Africa (GCC and Rest of the Middle East and Africa)
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Important Features of the reports:
- Detailed analysis of the High-Density Interconnect (HDI) PCBs for Semiconductor Market
- Fluctuating market dynamics of the industry
- Detailed High-Density Interconnect (HDI) PCBs for Semiconductor Market segmentation
- Historical, current and projected market size in terms of volume and value
- Recent industry trends and developments
- Competitive landscape of the High-Density Interconnect (HDI) PCBs for Semiconductor Market
- Strategies of key players and product offerings
- Potential and niche segments/regions exhibiting promising growth
- A neutral perspective towards High-Density Interconnect (HDI) PCBs for Semiconductor Market performance.
25% free Customization of the Report:
- Country level market for High-Density Interconnect (HDI) PCBs for Semiconductor Market (up to 5)
- Profiling and additional market players (up to 5)
- Free up to 40 hours of customization.
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