Market Overview

The global wafer cleaning equipment market, valued at USD 7.32 billion in 2023, is projected to grow from USD 7.87 billion in 2024 to USD 13.63 billion by 2031, representing a compound annual growth rate (CAGR) of 8.15% over the forecast period. Driving this expansion are continued investments in semiconductor capacity globally, particularly in Asia‑Pacific and North America, where new fabs demand highly advanced cleaning equipment to ensure yield at ever‑smaller process nodes.

Market Drivers & Dynamics

Rapid advancement in semiconductor manufacturing—especially migration to 5 nm, 3 nm and beyond nodes, increasing layer counts in 3D NAND, and adoption of chiplet/hetero‑integration architectures—is intensifying demand for ultra‑precise wafer cleaning techniques.
Meanwhile:

·         Rising complexity in device architectures (e.g. MEMS, power devices, advanced packaging) adds stringent particulate removal requirements.

·         Environmental regulations and water usage concerns are pushing demand toward chemical‑efficient, ultra‑pure water‑efficient, and even dry or cryogenic cleaning technologies.

·         Automation and process control integration, including real‑time sensors, are becoming standard in new equipment offerings.Trends & Recent Developments

Key trends reshaping the landscape include:

·         Single‑wafer spray systems are growing rapidly due to their precision and flexibility—projected to reach USD 4.30 billion by 2031.

·         Fully automatic operation mode is dominating, expected to account for USD 8.36 billion by 2031 as fabs push for consistency and throughput.

·         Cryogenic cleaning systems (single‑wafer cryo) are expanding fastest, at double‑digit CAGR in many reports, due to their minimal chemical usage and suitability for advanced nodes.

·         Environmental sustainability is influencing procurement: tools like ACM Research’s Tahoe cleaning tool, using 70‑80% less chemical mixture, underscore that shift.

·         Strategic collaborations like Fraunhofer IZM‑Assid and EV Group installing UV laser de‑bonding and cleaning tools in Germany signal innovation in process‑specific cleaning solutions.

Segmentation Snapshot

In 2023–24, the market breaks down broadly as follows (estimates based on linked segmentation data):

·         By equipment type:

o    Single‑wafer spray systems

o    Single‑wafer cryogenic systems

o    Batch immersion cleaning systems

o    Batch spray cleaning systems

o    Scrubbers and ultrasonic systems

·         By wafer size:

o    300 mm segment led, with revenues around USD 3.65 billion in 2023; growth toward ≥450 mm expected through 2030‑32

·         By mode of operation:

o    Automatic systems held the majority share (~74–75%) in 2024; semi‑automatic/manual remaining smaller portions

·         By application:

o    MEMS, memory (especially 3D NAND), logic/IC, power devices and packaging. Memory dominated ~30% share in 2024, with power discrete, IC and packaging growing fastest/

·         By end‑user:

o    Pure‑play foundries led with ~43% share, OSAT providers expected to grow at ~9% CAGR.

Regional Analysis

Regional performance reveals key dynamics:

·         Asia‑Pacific held the lion’s share (around 40% of the total, roughly USD 2.95 billion in 2023) and is the dominant region in both value and future growth.

·         North America is forecast to grow at ~8.3% CAGR over the period, benefiting from reshoring trends and investment into advanced wafer fabs.

·         China specifically is expanding fastest: domestic wafer cleaning equipment demand is growing at ~12.4% CAGR as local suppliers scale up amid state‑led semiconductor self‑sufficiency policies.

·         Europe maintains a smaller but steady position, supported by semiconductor manufacturing in Germany, Netherlands and France.

Key Players

Leading companies in the wafer cleaning equipment market include:

·         Applied Materials, Inc. – offering wet clean, spin clean, and bevel clean systems for high‑performance logic, memory, MEMS and packaging fabs.

·         Lam Research Corporation – delivers spin‑wet cleaning and plasma bevel-clean tools optimized for yield-critical advanced nodes .

·         Tokyo Electron Limited (TEL) – incorporated in major market reports as a key competitor in wash/clean steps.

·         Veeco Instruments Inc. – known for single‑wafer wet clean solutions, serving MEMS, photonics, power electronics fabs.

·         Screen Holdings Co., Ltd., Modutek Corporation, SÜSS MicroTec, PNC Process Systems, ACM Research, Inc. – notably in single‑wafer and wet cleaning niches, with strong presence in Asia especially China.

One standout recent story: ACM Research is experiencing explosive growth in China—99% of revenue comes from China optics—and is now targeting US expansion. Its Tahoe tool slashes chemical use; investors have seen nearly +78% stock rise in 2025.

Future Outlook

The wafer cleaning equipment market outlook remains robust:

·         Sustained fab expansions for AI, 5G, automotive electronics, IoT, and advanced packaging will drive equipment demand.

·         Miniaturization and new materials (GaN, SiC, advanced packaging substrates) raise cleaning complexity, making single‑wafer, cryogenic, and precision spray systems essential.

·         Sustainability and chemical reduction mandates open growth for tools using dry/cryogenic or low-chemical methods.

·         As domestic supply chains expand (especially in China/Asia), competition will shift, with more innovation from regional players.

·         Devices moving to 450 mm or beyond, or multi‑layer 3D structures, will push need for new classes of cleaning systems.

Bullet‑Style Highlights

·         Market size (2023): USD 7.32 billion; projected to grow to USD 13.63 billion by 2031 (CAGR 8.15%)

·         Major regions: Asia‑Pacific ~40% share; North America growing at ~8.3% CAGR; China individually fastest (~12.4%)

·         Leading segments: single‑wafer spray, fully automatic systems, 300 mm wafers, memory/MEMS applications

·         Key players: Applied Materials, Lam Research, Tokyo Electron, Veeco, Screen, ACM Research, PNC, SÜSS MicroTec

·         Trend accelerators: node shrinkage, 3D stacking, automation, sustainability, precision cleaning tech, reshoring

·         Notable recent move: ACM’s Tahoe tool uses far less chemicals; US expansion plan following strong Chinese base

Conclusion & Next Steps

The wafer cleaning equipment segment is entering a period of dynamic and sustained expansion, fueled by semiconductor complexity, new fabs, environmental regulations and automation. With Asia‑Pacific leading demand and players like ACM Research pushing innovation and regionalization, the competitive landscape is shifting—but dominated still by the legacy giants.

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